L2 cache socket secc1

Intel Pentium G3220 3.00 GHz 3Mo Cache Socket 1150. Désignation Intel Pentium G3220 (3 GHz) Marque Intel Modèle BX80646G3220 PRINCIPALES CARACTÉRISTIQUES Modèle de processeur Intel Pentium Support du processeur Intel 1150 Fréquence CPU 3 GHz Fréquence du bus DMI 5.0 GT/s Nombre de core 2 Nombre de Threads 2 Plateforme (Proc.) Intel Haswell ARCHITECTURE Nom du core Haswell Finesse de gravure 0.022 Micron TDP 54 W Cache L2 512 ko Cache L3 3 Mo Compatibilité chipset carte mère Intel Z87 Express Intel H87 Express Intel B85 Express Intel Q87 Express Intel H81 Express Intel Z97 Express CHIPSET GRAPHIQUE Chipset graphique Intel HD Graphics (Haswell) Fréquence boostée 1100 MHz CONTRÔLEUR MÉMOIRE Contrôleur mémoire DDR3 Type de contrôleur mémoire Dual Channel Fréquence(s) Mémoire DDR3 1333 MHz TECHNOLOGIES AVANCÉES Virtualisation Intel Virtualization VT

Processeur Intel celeron D335(2,8 Ghz)- - 256 Kb L2 Cache - Socket 478. État: Occasion Service de livraison: Lettre Suivie

PROCESSEUR   provenant du démontage d'une configuration Totalement fonctionnelle testé  dans nos ateliers  Le processeur est vendu avec son système de refroidissement  - Marque AMD  - Modèle ADH4450IAA5D0 Référence: AMD Atlhon x2 4450e / ADH4450IAA5D0 Nombre de coeurs: 2 Fréquence: 2.3 Ghz Socket carte mère: AM2 L2 Cache: 512ko Nombre de L2 Cache : 2 Vous achetez le CPU que vous voyez sur les photos. - es commandes seront expédiées sous 24 à 48 heures ouvrables du lundi au vendredi. - Un e-mail vous sera envoyer avec le numéro de suivi. - Les frais d'envois comprennent les frais Postaux, le coût de l'emballage et les protections. - Frais de port recalculés si achat multiple. - Envoie gratuit pour la majorité des cas.(MONDIAL RELAY ou lettre avec suivi selon le processeur commandé) - Livraison  par colissimo 6,70euros   - Choix du transporteur entre Mondial Relay, Colissimo, lettre suivie - Choix du point relay à cette adresse https://www.mondialrelay.fr/trouver-le-point-relais-le-plus-proche-de-chez-moi/ Aide pour le payement  - Paiement par paypal préféré. - Pour les paiements par virement ou chèque nous contacter avant l'achat  strickleralex@gmail.com                                                                                          Collecte de parc et matériel informatique  faites appel à INFOCAZE                                                                                        INFOCAZE  reconditionne vos équipements informatiques de façon solidaire et durable. - Livraison  Colissimo (chez vous)  :8,90 - Livraison  point relais (MONDIAL RELAY):  GRATUIT Si vous avez des questions écrivez moi

CPU + FAN General informationTypeCPU / MicroprocessorMarket segmentDesktopFamily AMD Athlon II X2Model number  ? 220CPU part numbers - ADX220OCK22GM is an OEM/tray microprocessor Stepping codesCACAC AC   CACEC AC   NADIC AD   NAEGC AE   NAEKC AEFrequency  ? 2800 MHzBus speed  ? 533 MHz Memory controller One 2000 MHz 16-bit HyperTransport linkClock multiplier  ? 14Package938-pin organic micro Pin Grid Array (UOF938)SocketsSocket AM2+ Socket AM3Introduction dateMay 2010Architecture / MicroarchitectureMicroarchitectureK10Processor core  ? RegorCore stepping  ? DA-C3CPUID100F63Manufacturing process0.045 micron 234 million transistorsDie117.5mm2Data width64 bitThe number of CPU cores2The number of threads2Floating Point UnitIntegratedLevel 1 cache size  ? 2 x 64 KB 2-way set associative instruction caches 2 x 64 KB 2-way set associative data cachesLevel 2 cache size  ? 2 x 512 KB 16-way set associative cachesLevel 3 cache sizeNoneCache latency3 (L1 cache) 15 (L2 cache)MultiprocessingUniprocessorExtensions and Technologies - MMX instructions - Extensions to MMX - 3DNow! technology - Extensions to 3DNow! - SSE / Streaming SIMD Extensions - SSE2 / Streaming SIMD Extensions 2 - SSE3 / Streaming SIMD Extensions 3 - SSE4a  ?  - AMD64 / AMD 64-bit technology  ?  - AMD-V / AMD Virtualization technology Security Features - EVP / Enhanced Virus Protection  ?  Low power features - Cool'n'Quiet 3.0 - CoolCore Technology  ?  - Dual Dynamic Power Management  ?  - Core C1 and C1E states - Package S0, S1, S3, S4 and S5 states Integrated peripherals / componentsIntegrated graphicsNoneMemory controllerThe number of controllers: 1 Memory channels: 2 Supported memory: DDR2, DDR3Other peripherals - HyperTransport 3 technology Electrical / Thermal parametersV core  ? 0.9V - 1.4VMaximum operating temperature  ? 74°CThermal Design Power  ? 65 Watt

Intel Xeon 8 core CPU E5-2630LV3 20 M Cache 1.80 GHz-SR209 atttention ! for Intra-Community sale not subject to VAT important mandatory export sales conditions for companies. 1: you must ask request withdrawal of VAT to the seller before ordering (important) 2: your paypal account or your bank account must be a professional account only (proof requested) 3: the delivery address must be the same as the company requesting the withdrawal of VAT if one of these conditions is not valid we can not accept the withdrawal of VAT if your request is accepted we can send you a payment request directly. Thank you for your attention Condition: Used / Tested Occasion testé Physical Condition: Good / état ok Warranty Provided: 90 Days / garantie de 3 mois Facture avec TVA  - Invoice with VAT  Intel Xeon 8 core CPU E5-2630LV3 20 M Cache 1.80 GHz-SR209 General information Type    CPU / Microprocessor Family    Intel Xeon Processor number  ?     E5-2630L v3 Part number    CM8064401832100 Frequency (GHz)  ?     1.8 Maximum Turbo frequency (GHz)    2.9 Clock multiplier  ?     18 Package type    2011-land FC-LGA Socket type    Socket 2011-3 (LGA2011-3) Architecture / Microarchitecture / Other CPUID    0306F2h Core stepping    R2 Processor core    Haswell-EP Manufacturing technology (micron)    0.022 Number of cores    8 L2 cache size (MB)  ?     2 L3 cache size (MB)    20 Features    AES AVX AVX2 EM64T technology  ? Enhanced SpeedStep technology  ? Execute disable bit  ? Hyper-Threading technology MMX SSE SSE2 SSE3 SSE4 SSSE3 Trusted Execution technology Turbo Boost technology Virtualization technology (VT-d) Virtualization technology (VT-x) Case temperature (°C)  ?     60.4 Thermal Design Power (Watt)  ?     55 Notes on sSpec SR209     QuickPath Interconnect speed is 8 GT/s.     The processor supports DDR4-1866 memory.     Direct Media Interface speed is 5 GT/s.     The CPU supports ECC memory.     The processor has 1 memory controller Le 15-févr.-19 à 20:50:34 Paris, le vendeur a ajouté les informations suivantes: note, direct offers are only accepted for batch purchases - attention, les offres directes sont acceptés uniquement pour les achats de lot

VENDS PROCESSEUR AMD  ATHLON  64  2850e K8  SOCKET AM2  1.8 ghz  architecture LIMA cache 512 mg , fonctionne parfaitement, pas de pins tordues. Port mondial  relais  4 euros  General specsMicroarchitecture:K8Core Name:LimaManufacturing Process:0.065 micronSocket Type:Socket AM2The Number of Cores:1The Number of Threads:1Multiprocessing:Not supportedFrequency:1.8 GHzL1 Cache:64 KB (code) 64 KB (data)L2 Cache:512KBThermal Design Power:22 Watt  Port mondial  relais  4 euros

processeurs p8700/ 2.53GHz/ 2 Cores / Threads 2 / socket 478/teste OK. État : "Occasion"  Intel® Core™2 Duo Processor P8700 (3M Cache, 2.53 GHz, 1066 MHz FSB) - Vertical Segment Mobile - Processor Number P8700 - Status Discontinued - Launch Date Q4'08 - Lithography 45 nm Performance Specifications - # of Cores 2 - # of Threads 2 - Processor Base Frequency 2.53 GHz - Cache 3 MB L2 Cache - Bus Speed 1066 MHz - FSB Parity No - TDP 25 W - VID Voltage Range 1.00V - 1.25V Supplemental Information - Embedded Options Available No Package Specifications - Sockets Supported BGA479, PGA478 - TJUNCTION 105°C - Package Size 35mm x 35mm - Processing Die Size 107 mm2 - # of Processing Die Transistors 410 million Advanced Technologies - Intel® Turbo Boost Technology ‡ No - Intel® Hyper-Threading Technology ‡ No - Intel® Virtualization Technology (VT-x) ‡ Yes - Intel® 64 ‡ Yes - Instruction Set 64-bit - Idle States Yes - Enhanced Intel SpeedStep® Technology Yes - Intel® Demand Based Switching No Security & Reliability - Intel® Trusted Execution Technology ‡ Yes - Execute Disable Bit ‡ Yes  Intel® Core™2 Duo Processor P8700 (3M Cache, 2.53 GHz, 1066 MHz FSB)

Lot testé ensemble, processeur i3 4340 3.60 GHz 2x 4Go kingston Asus H87M-PLUS Fiche technique Caractéristiques techniques Format Micro ATX Socket Socket H3 (LGA 1150) Famille de processeur Intel Processeurs compatibles Celeron,Core i3,Core i5,Core i7,Pentium Famille de chipset Intel Chipset Intel H87 Ethernet Oui Standard Ethernet Gigabit Ethernet Mémoire Type de mémoire vive DDR3-SDRAM Mémoire interne maximale 32 Go Connecteurs internes Slots mémoire 4 PCI Express 16x 2 SATA 6 Connecteurs externes USB 3 (3.1 Gen 1) Type A 4 USB 2 2 Nombre de ports Ethernet 1 Gbit/s 1 Sortie VGA Oui Sortie HDMI Oui Dimensions Largeur 244 mm Profondeur 219 mm Informations complémentaires Autres Mémoire de type fentes: DIMM, Prise en charge de la mémoire vitesse d'horloge: 1066,1300,1600 MHz, Canaux de mémoire: Dual, Non-ECC: Oui, Pris en charge les capacités du module de mémoire: 8GB, Mémoire sans tampon: Oui, Connecteurs USB 2.0: 3, connecteurs USB 3,0 (3,1 Gen 1): 1, Interfaces de lecteur de stockage prises en charge: Série ATA III, Sortie S/PDIF: Oui, Connecteur CPU FAN: Oui, Nombre de connecteurs COM: 1, Connecteur ATX (24 broches): Oui, Nombre de connecteur pour le ventilateur du boîtier: 2, Connecteur audio panneau avant: Oui, Connecteur TPM: Oui, Connecteur EPS power (8-pin): Oui, Connecteur parallèle: Oui, Nombre de ports PS/2: 1, Quantité de ports DVI-D: 1, Sortie de casque: 1, Entrée jack microphone: Oui, Contrôleur de réseau local (LAN): Realtek 8111G, composant pour: PC, Niveaux RAID: 0, 1, 5, 10, Système audio: Realtek ALC887, Taille de la mémoire vidéo: 1024 Mo, Technologie de Traitement en parallèle: Quad-GPU CrossFireX, Résolution maximale: 4096 x 2160 pixels, À bord adaptateur graphique: Oui, Emplacements PCI: 2, Type de BIOS: UEFI AMI, Version ACPI: 2.0a, Cavalier CMOS d'effacement: Oui, Câbles inclus: SATA, Drivers inclus: Oui, Guide d'installation rapide: Oui SR1NL specifications The specs can be used for short-term listings on auction and classifieds sites General information TypeCPU / Microprocessor FamilyIntel Core i3 Processor number  ? i3-4340 Part numberCM8064601482422 BX80646I34340 BXC80646I34340 Frequency (GHz)  ? 3.6 Clock multiplier  ? 36 Package type1150-land FC-LGA12C Socket typeSocket 1150 (LGA1150) Architecture / Microarchitecture / Other Core steppingC0 Processor coreHaswell Manufacturing technology (micron)0.022 Number of cores2 L2 cache size (KB)  ? 512 L3 cache size (MB)4 FeaturesAES AVX AVX2 EM64T technology  ?  Enhanced SpeedStep technology  ?  Execute disable bit  ?  Hyper-Threading technology MMX SSE SSE2 SSE3 SSE4 SSSE3 Virtualization technology (VT-x) Case temperature (°C)  ? 72 Thermal Design Power (Watt)  ? 54

Features/Specifications: - AMD Athlon 64 X2 4450e Socket AM2 Dual-Core CPU - General Features: - AMD Athlon 64 X2 4450e Dual-Core CPU - 2,3 GHz Core Speed - 512 Ko L2 Cache (2 cache) - Socket AM2 - 32/64 bit operating mode - 1.25 - 1.35V Voltage - HyperTransport technology - Enhanced Virus Protection - Cool 'n' Quiet Technology   Créé par L'outil de mise en vente gratuit. Mettez vos objets en vente rapidement et en toute simplicité, et gérez vos annonces en cours.

General specsRelease date:2012Microarchitecture:Ivy BridgeCore Name:Ivy BridgeManufacturing Process:0.022 micronSocket Type:Socket 1155The Number of Cores:2The Number of Threads:4Multiprocessing:Not supportedFrequency:3.3 GHzL1 Cache:64 KB (code) 64 KB (data)L2 Cache:512KBL3 Cache:3 MBThermal Design Power:55 WattIntegrated GPU:HD 2500Supported memory:DDR3-1333 / DDR3-1600 Instructions and TechnologiesExecute Disable Bit?Yes64-bit Support?YesHyper-Threading technology?YesVirtualization?YesEnhanced SpeedStep?YesInstruction Set Extensions:AVX F16C MMX SSE SSE2 SSE3 SSE4 Supplemental SSE3 Part numbers of tray Intel Core i3-3220 microprocessors are CM8063701137502, CM8063701246900 and CM8063701247200. Boxed processors are offered with BX80637I33220 part number. Boxed products for Chinese market have BXC80637I33220 part number. Please check Intel Core i3 page for details on other microprocessors from the family. Core i3-3220 S-Spec numbers Production versions of this Core i3 CPU had the following S-spec number: S-Spec numberSteppingCPU IDSR0RGL1

Processeur Intel Core2 Quad Q6600 8 Mo de cache, 2,40 GHz, bus frontal à 1066 MHz Socket LGA775 Compatible système 64bits Nb. de c?urs 4 Fréquence de base 2,40 GHz Cache 8 MB L2 Cache Vitesse du bus 1066 MHz PDT 105 W Plage de fréquences VID 0.8500V-1.500V Spécifications du package Technologie Intel® Hyper-Threading ? Non Technologie de virtualisation Intel® (VT-x) ? Oui Intel® 64 ? Oui Jeux d'instructions 64-bit États d'inactivité Oui Technologie Intel SpeedStep® améliorée Oui Technologies de surveillance thermique Oui Informatique neuf à vendre à La Seyne-sur-Mer (83500): matériel informatique à acheter dans le Var (83)

Processeur Intel Xeon E3-1240V5 3.50 GHz Quad-Core Socket 1150. ·        Condition de l'article: D'occasion ·        Marque de processeur: Intel ·        Type de socket: LGA 1150 ·        Numéro du modèle: E3-1240V5 ·        Type: Quad-Core ·        Fréquence du CPU: 3.5 GHz ·        Type de processeur: Intel Xeon ·        L2 Cache Capacity: 1 MB ·        L3 Cache Capacity: 8 MB ·        Puissance: 80 W ·        Fréquence principale: 3.50GHz ·        Number of Cores: Quad-Core ·        Support 64-bit: Oui ·        Type d'interface: LGA1150 ·        Nom de la marque: Intel ·        Intel modèlent: E3-1240V5

The PA-7300LC The First "System on a Chip" Presented at Microprocessor Forum on 10/16/95 by Tom Meyer The PA-7300LC is a new processor design, which features a high level of integration of system functions. HP's PA-RISC processor family currently features two "streams" of CPU development. Each is optimized to meet the needs of different classes of computer systems. The high-end stream, which includes the PA-7200 and PA-8000 chips, is optimized for very high performance, highly expandable power desktops and servers. Several years ago it was determined that HP could best meet the needs of higher volume, more cost sensitive products by developing a different set of CPUs tuned to the special requirements of these systems. This processor line began with the PA-7100LC, which first began shipping in January of 1994, and continues with the new design described in this paper. We refer to this as our "low end" but it is also a "no compromise" stream, since we consider cost, performance, power, and other design objectives to all be equally high priority. Meeting the design objectives by finding the right balance between these factors is the main challenge in this area of microprocessor design. Design Objectives The design objectives of the PA-7300LC chip are nearly identical to those of its predecessor, which has proven to be a successful volume work-horse processor. Design improvements and a more advanced VLSI technology have allowed the designers to achieve roughly twice the performance of the 100MHz PA-7100LC without compromising cost or any of the other objectives. Like previous PA-RISC chips, the team evaluated the cost of design tradeoffs using a holistic approach which emphasizes total system cost, rather than just trying to design a cheap microprocessor without regard to the rest of the system. In defining the PA-7300LC HP's design team carefully considered the requirements of realistic system applications and tuned the design to meet those needs rather than just optimizing for microprocessor-level benchmarks. As a result, a large part of the design effort focused on minimizing the number of system components, reducing test and diagnostic costs, and getting the right level of functional partitioning. System designers and manufacturing engineers were consulted throughout the design. As you will see, many chip level features have been included to address these objectives. PA-7300LC Overview This design features a superscalar processor core that was highly leveraged from the PA-7100LC core. Enhancements include a large on-chip primary cache, an integrated DRAM and L2 cache controller, and an improved I/O bus controller. The chip uses established technologies including HP's half micron CMOS process and a low-cost ceramic pin-grid array package. The preliminary performance projections you see here assume 1 Mbyte of secondary cache and 60ns fast-page-mode DRAMs, but the chip can be configured with higher performance memory components. We believe that this processor will do very well on memory intensive programs as shown by the SPEC95 and OLTP estimates. This is because of the highly optimized memory hierarchy I will describe in a moment. PA-7300LC Chip Layout The RISC processor core, consisting of the integer units, floating-point unit, and instruction decode logic occupy the right side of the die. The center blocks contain the virtual memory translation lookaside buffer (TLB) and Memory and I/O controller or MIOC. The large, denser-looking blocks are the instruction and data caches. Nearly 8 million of the 9.2 million transistors are contained in these two blocks. As you can see, a large amount of chip real estate is devoted to embedded SRAM for the primary caches. It's been said that future microprocessors will look like large memory chips with a small microprocessor block in the corner. The 7300LC has really headed in that direction with this chip since the cache arrays occupy 40% of the chip area. As a si

Paire de CPU Processeurs Intel Xeon 3.6Ghz 800Mhz FSB 1mb L2 cache 64bit - socket PPGA604 112mm², 1 cœur, Hyperthreading État : Occasion Parfait état de marche. Intel Chipset: E7520, E7525, E7320 1,4V max Core Voltage Vendus avec dissipateurs thermiques et ventilateurs + vis 2 unités vendues

Processeur et ventirad pour serveur DELL Processeur: SL8P5 Intel Xeon Socket 604 HeatSink DELL 0GF449 pour DELL PowerEdge 2950 General information TypeCPU / Microprocessor FamilyIntel Xeon Part numberBX80546KG3200FA BX80546KG3200FP BX80546KG3200FU Frequency (GHz)  ? 3.2 Bus speed (MHz)  ? 800 Package type604-pin FC-PGA4/mPGA Socket typeSocket 604 Architecture / Microarchitecture / Other CPUID0F4Ah Core steppingR0 Previous steppingSL7ZE Processor coreIrwindale Manufacturing technology (micron)0.09 L2 cache size (MB)  ? 2 FeaturesExecute disable bit  ?  Thermal Monitor 2 Core voltage (V)  ? 1.25 - 1.4 Case temperature (°C)  ? 72 Thermal Design Power (Watt)  ? 110 Processor interposer revision01